| Device name | Hot Press Machine |
| Device Model | CR-880DH-19M |
| Device Description | Screen repair equipment, LCD repair equipment, COF/TAB bonding equipment, etc. |
| Device Uses | This product is used in a variety of FPC, COF, TAB and LCD Panel and PCB combination bonding, is reflected in a variety of sizes LCD vertical, horizontal, vertical band, horizontal belt, black belt, black, colored thread, ribbon , multi-line, black, black and white, vertical half display,horizontal half breakdown maintenance. |
| Device Features | Double bonding heads,dual pneumatic device, dual temperature control |
| Multi-speed pulse source design to meet the power requirements of diversified product pressure | |
| Applicable LCD panel specifications | 15"-65"(Platform expandable) |
| Applicable LCD panel thickness | 0.3MM-1.1MM[Single glass] |
| Panel type | TFT |
| Bonding IC number | One/PANEL |
| Bonding direction | X or Y Unidirection |
| Bonding head size | The original left head is equipped with 50X1.2X10MM and the right head is equipped with 50X2.0X10MM(The size of the bonding head can be changed according to the IC specifications) |
| Equipment process time | TFT,3.8S/chip |
| Production beat | TAB,100pcs/H |
| Bonding accuracy | ±1.5µm (support 4K) |
| Highest positioning accuracy setting | ±0.5μm |
| Equipment requirements work environment | Clean, dust-free, clean room |
| Supply pressure | 0.1~0.7Mpa Dry air source |
| Power supply | AC 220V±10%,50HZ,3500W |
| Pneumatic device | Air TAC Original precision cylinder |
| Pressure system | Pressure system parallel bar structure eliminates the weight of the indenter,pressure minimum accuracy can up to 0.1 KG,pressure components are using SMC precision components. |
| Heating method | Pulse (rapid heating/cooling and auxiliary cooling) |
| Temperature Control System | Brand:Omron |
| Adjustable temperature rise curve with high precision PID auto-tuning | |
| The peak temperature : within +/-1degrees Celsius | |
| Room temperature time to 180 degrees the response time within 2-3 seconds | |
| Hot pressing head | Material: Titanium alloy |
| Metal properties:SUS440C | |
| Origin: United States | |
| Plane precision (hot pressing surface) :0.001mm | |
| Plane thickness 0.5 (keep 3 times grinding) | |
| Thermocouple Type | K type Original US OMEGA wire |
| Industrial control unit / programme | Panasonic PLC FX-C14T |
| Panasonic Image Processing System | |
| Touch unit | Display control Samkoon dual-core touch screen |
| Image unit | COF counterpoint: Down counterpoint (Optical Path: Lens> Quartz> ITO Electrode> COF) |
| PCB alignment: Have | |
| Number of lens: 3 | |
| Microscope: 30-120 continuous zoom | |
| COF display: 18.5 inches HD | |
| PCB alignment display: Can be switched directly in COF alignment display | |
| COF trimming unit | Origin: China |
| Rail type: U-rail | |
| Accuracy:0.01 | |
| Adjustable direction:X/Y/R | |
| R stroke: coarse adjustment 360 degrees, fine adjustment +/- 5 degrees | |
| COF fixture | COF mechanical clamping type ,Z-direction tilt radius micrometer fine-tuning |
| Lens spinner unit | Control mode: X / Y / Z micrometer control |
| Focus Adjustment: Manually adjust the focus | |
| Silicone / Teflon | Manual switching position |
| LCD stage (platform) | Manual sliding movement, self-contained vacuum adsorption device |
| Bonding head alignment | The cylinder can be set to stop in any position in the upper and lower directions |
| Control method | Touch screen + button operation |
| Parameter setting | Can store multiple sets of hot pressing parameters as needed |
| Rated voltage | AC 180-220V |
| Peak power | 400-1100W (can support 68X1.4X10 wide bonding head) |
| Maximum power | 1100W |
| Actual power | 580W |
| Body size | 1800X1200x1520mm(L*W*H) |
| Net weight of equipment | 380KG |
| Number of packages | 2 |
| Equipment packaging | Wooden boxes, non-logs (material is glued board, no fumigation is required for export) |
| Package size and gross weight | 1240X840X1680mm(L*W*H)368KG |
| ‚1920X240X960mm(L*W*H) 110KG | |
| The following picture is the device after packaged. | |